Fri, 20 Nov 2015 22:03:17 +0100 sundayman <s...@p...onet.pl>
napisał:

>No dobrze, ale - na litość - ja rozumiem, że przy minus 20 pewnie
>pojemność będzie odmienna od deklarowanej. To wynika z ich
>charakterystyki. Ale kuśwa - przecież to nie ma prawa zamienić go w
>rezystor chyba ?

Może po prostu popękał (nie musi być tego widać na zewnątrz) od
naprężeń. Przy zmianach temperatury w szerokim zakresie ławiej o to.

Z wikipedii:

"Mechanical susceptibility

Ceramic is on the one hand a very solid material; on the other hand,
it breaks even at relatively low mechanical stress. MLCC chips as
surface-mounted components are susceptible to flexing stresses since
they are mounted directly on the substrate. They are stuck between
soldered joints on the printed circuit board (PCB), and are often
exposed to mechanical stresses, for example, if vibration or a bump
impacts the circuit board. They are also more sensitive to thermal
stresses than leaded components. Excess solder fillet height can
multiply these stresses and cause chip cracking. Of all influencing
factors, causing a mechanical shock stress to the PCB proved to be the
most critical one.[26] The reason is that forces induced by those
kinds of stresses are more or less transmitted undampened to the
components via the PCB and solder joints."

https://en.wikipedia.org/wiki/Ceramic_capacitor#Mult
i-layer_ceramic_capacitors_.28MLCC.29

Parę obrazków:
https://en.wikipedia.org/wiki/File:MLCC-Schliffbild-
mit-Bruch.png
http://www.semlab.com/examples/devices/example30.htm
l
http://www.semlab.com/examples/devices/serex12.html


Google znajduje sporo pod hasłami typu "MLCC failure" czy "MLCC
crack".