> Może po prostu popękał (nie musi być tego widać na zewnątrz) od
> naprężeń. Przy zmianach temperatury w szerokim zakresie ławiej o to.

Niemożliwe... urządź był zamontowany jakiś miesiąc wstecz. Więc nie było
żadnych ekstremalnych temperatur przecież...


>
> Z wikipedii:
>
> "Mechanical susceptibility
>
> Ceramic is on the one hand a very solid material; on the other hand,
> it breaks even at relatively low mechanical stress. MLCC chips as
> surface-mounted components are susceptible to flexing stresses since
> they are mounted directly on the substrate. They are stuck between
> soldered joints on the printed circuit board (PCB), and are often
> exposed to mechanical stresses, for example, if vibration or a bump
> impacts the circuit board. They are also more sensitive to thermal
> stresses than leaded components. Excess solder fillet height can
> multiply these stresses and cause chip cracking. Of all influencing
> factors, causing a mechanical shock stress to the PCB proved to be the
> most critical one.[26] The reason is that forces induced by those
> kinds of stresses are more or less transmitted undampened to the
> components via the PCB and solder joints."
>
> https://en.wikipedia.org/wiki/Ceramic_capacitor#Mult
i-layer_ceramic_capacitors_.28MLCC.29
>
> Parę obrazków:
> https://en.wikipedia.org/wiki/File:MLCC-Schliffbild-
mit-Bruch.png
> http://www.semlab.com/examples/devices/example30.htm
l
> http://www.semlab.com/examples/devices/serex12.html
>
>
> Google znajduje sporo pod hasłami typu "MLCC failure" czy "MLCC
> crack".
>

dzięki, poczytam.